DocumentCode
661556
Title
Approach to the silicon limit: Advanced NLDMOS in 0.13 μm SOI technology for automotive and industrial applications up to 110V
Author
Hongning Yang ; Jiangkai Zuo ; Zhihong Zhang ; Wongi Min ; Xin Lin ; Xu Cheng ; Muh-Ling Ger ; Hui, Paul ; Rodriquez, Pete
Author_Institution
Freescale Semicond. Inc., Tempe, AZ, USA
fYear
2013
fDate
26-30 May 2013
Firstpage
357
Lastpage
360
Abstract
We report our development of a novel NLDMOS in SOI based smart power technology, integrated into Freescale´s 0.13μm CMOS platform. The new NLDMOS not only achieves BVDSS up to 140V in both low side and high side operations, but more importantly, the Rdson*Area is able to shrink at least 35-40% below the current benchmark, which is the lowest reported for BVDSS ranging from 50V to 138V. For the first time, we demonstrated LDMOS devices which approach the Si limit. The devices also achieve very competitive performance in both SOA and the reliability tests under HCI stress as well as high temperature reverse bias (HTRB) stress.
Keywords
CMOS integrated circuits; MIS devices; elemental semiconductors; power integrated circuits; silicon; silicon-on-insulator; Freescale CMOS platform; NCI stress; Rdson*Area; SOI technology; Si; advanced NLDMOS; automotive applications; high side operations; high temperature reverse bias stress; industrial applications; low side operations; reliability tests; silicon limit; size 0.13 mum; smart power technology; voltage 50 V to 138 V; Benchmark testing; Degradation; Human computer interaction; Reliability; Semiconductor optical amplifiers; Silicon; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
Conference_Location
Kanazawa
ISSN
1943-653X
Print_ISBN
978-1-4673-5134-8
Type
conf
DOI
10.1109/ISPSD.2013.6694421
Filename
6694421
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