• DocumentCode
    661556
  • Title

    Approach to the silicon limit: Advanced NLDMOS in 0.13 μm SOI technology for automotive and industrial applications up to 110V

  • Author

    Hongning Yang ; Jiangkai Zuo ; Zhihong Zhang ; Wongi Min ; Xin Lin ; Xu Cheng ; Muh-Ling Ger ; Hui, Paul ; Rodriquez, Pete

  • Author_Institution
    Freescale Semicond. Inc., Tempe, AZ, USA
  • fYear
    2013
  • fDate
    26-30 May 2013
  • Firstpage
    357
  • Lastpage
    360
  • Abstract
    We report our development of a novel NLDMOS in SOI based smart power technology, integrated into Freescale´s 0.13μm CMOS platform. The new NLDMOS not only achieves BVDSS up to 140V in both low side and high side operations, but more importantly, the Rdson*Area is able to shrink at least 35-40% below the current benchmark, which is the lowest reported for BVDSS ranging from 50V to 138V. For the first time, we demonstrated LDMOS devices which approach the Si limit. The devices also achieve very competitive performance in both SOA and the reliability tests under HCI stress as well as high temperature reverse bias (HTRB) stress.
  • Keywords
    CMOS integrated circuits; MIS devices; elemental semiconductors; power integrated circuits; silicon; silicon-on-insulator; Freescale CMOS platform; NCI stress; Rdson*Area; SOI technology; Si; advanced NLDMOS; automotive applications; high side operations; high temperature reverse bias stress; industrial applications; low side operations; reliability tests; silicon limit; size 0.13 mum; smart power technology; voltage 50 V to 138 V; Benchmark testing; Degradation; Human computer interaction; Reliability; Semiconductor optical amplifiers; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
  • Conference_Location
    Kanazawa
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4673-5134-8
  • Type

    conf

  • DOI
    10.1109/ISPSD.2013.6694421
  • Filename
    6694421