DocumentCode :
662007
Title :
Shielding cover effects on the RF performance of LDMOSFET power amplifier for WCDMA application
Author :
Liang Lin ; Gang Cheng ; Wen-Yan Yin ; Liang Zhou
Author_Institution :
Key Lab. of Minist. of Educ. of Design & EMC of High-Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2013
fDate :
5-8 Nov. 2013
Firstpage :
609
Lastpage :
611
Abstract :
Shielding cover effects on the RF performance of LDMOSFET power amplifier (PA) is investigated. In our measurement, the PA cover is made of aluminum, with its height adjusted from 8.4 to 14.4mm which are widely used in current wireless communication application. The input-output responses of several PA samples with cover are measured and compared for different cover heights. Both experiment and simulation show that as the cover height is reduced, the PA performance is degraded, but its power efficiency and linearity are not varied approximately. Further, it is found that, even the cover height is decreased, but through careful optimizing of its internal impedance matching networks consisting of multiple bonding wires, the PA performance can be improved effectively. This research can provide some useful design guidance for the development of compact and miniaturized PA module with high performance.
Keywords :
MOSFET circuits; code division multiple access; impedance matching; power amplifiers; shielding; LDMOSFET power amplifier; RF performance; WCDMA application; impedance matching networks; multiple bonding wires; shielding cover effects; wireless communication; Bonding; Gain; Integrated circuit modeling; Loss measurement; Radio frequency; Resonant frequency; Wires; LDMOSFET; PA; bonding wires; cover; impedance match; inner resonance; shielding effect;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings (APMC), 2013 Asia-Pacific
Conference_Location :
Seoul
Type :
conf
DOI :
10.1109/APMC.2013.6694880
Filename :
6694880
Link To Document :
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