Title :
Vertical signal transmission by non-contact technology application for 3DIC
Author :
Jun-Kai Wang ; Ren-Fang Hsu ; Wen-Te Chien ; Sung-Mao Wu ; Cheng-Chang Chen ; Ming-Shan Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
Abstract :
In order to solve the problem of process and cost in 3D-IC, novel non-contact signal transmission with coupling loops have been presented. In this study, we design the broadband, well reproducibility, well directivity and low loss coupling loops to transmit signal between different chips or ICs in 3DIC application, and establishing physical model up to 10GHz with coupling effect and loop effect to restore the signal radiation. By this method, the overall signal transmission of TSV can be the same as the non-contact technology. People can use this design to replace the TSV technology in the future.
Keywords :
integrated circuit design; integrated circuit modelling; integrated circuit packaging; three-dimensional integrated circuits; 3DIC; TSV technology; low loss coupling loop; noncontact signal transmission; noncontact technology; signal radiation; three-dimensional integrated circuits; through-silicon-via technology; vertical signal transmission; Broadband communication; Capacitance; Coplanar waveguides; Couplings; Loss measurement; Microwave theory and techniques; Through-silicon vias; 3DIC; Non-contact; Radiation model; Signal transmission; TSV;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2013 Asia-Pacific
Conference_Location :
Seoul
DOI :
10.1109/APMC.2013.6694946
