Packaging of MMIC by using gap waveguide and design of a microstrip to ridge gap waveguide transition

Author

Zaman, A.U. ; Kildal, Per-Simon

Author_Institution

Signals & Syst. Dept., Chalmers Univ. of Technol., Gothenburg, Sweden

fYear

2013

fDate

5-8 Nov. 2013

Firstpage

10

Lastpage

12

Abstract

In this work, gap waveguide based packaging technique is used to improve the isolation among critical microwave circuit components such as high gain amplifier chain. Amplifier chains at Ka-band were tested for a stable forward gain and it was found that-with gap waveguide packaging, 65~70dB of forward gain is achievable without the problem of self-resonance. Apart from the new packaging technique, a low-loss transition from microstrip to ridge-gap waveguide had been designed and tested. This transition is a key component to connect such amplifier chains to a planar slot array antenna. Experimental results for manufactured back to back transition show 14 dB return loss over 55% relative bandwidth from 2343GHz.

Keywords

MIMIC; MMIC amplifiers; integrated circuit design; integrated circuit packaging; integrated circuit testing; isolation technology; microstrip transitions; microwave amplifiers; millimetre wave amplifiers; millimetre wave antenna arrays; planar antenna arrays; ridge waveguides; slot antenna arrays; waveguide transitions; Ka-band; MMIC packaging; amplifier chain; bandwidth 23 GHz to 43 GHz; gain 65 dB to 70 dB; gap waveguide packaging technique; isolation technology; loss 14 dB; low-loss transition; microstrip-ridge gap waveguide transition; microwave circuit component; planar slot array antenna; Gain; Microwave amplifiers; Microwave circuits; Packaging; Radio frequency; Waveguide discontinuities; Cross-talk; PEC; PMC; Ridge gap waveguide; Slot-array antenna; feedback; self-oscillation;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings (APMC), 2013 Asia-Pacific

Conference_Location

Seoul

Type

conf

DOI

10.1109/APMC.2013.6695174

Filename

6695174