• DocumentCode
    662656
  • Title

    Performance and robustness of first generation 600-V GaN-on-Si power transistors

  • Author

    Wu, Y.-F. ; Gritters, J. ; Shen, L. ; Smith, R.P. ; McKay, Judith ; Barr, R. ; Birkhahn, R.

  • Author_Institution
    Transphorm Inc., Goleta, CA, USA
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    6
  • Lastpage
    10
  • Abstract
    Industry´s first 600-V GaN-on-Si switching transistors have passed qualification based on Jedec standards and entered commercial market. Although far from being optimized, these 1st generation GaN devices exhibit properties superior to matured Si counterparts including lower on-resistance, much reduced input/output charges, and much higher switching speed. Application examples show significant loss reduction at high frequencies and markedly simplified hard-switched bridge circuits, offering a new means for designing more compact and efficient power systems. Extended SOA tests revealed a large margin in blocking voltage even at 175 °C, ability to deliver 99% peak efficiency at 187°C case temperature and high power operation at 215°C junction temperature with a very-low degradation rate.
  • Keywords
    III-V semiconductors; bridge circuits; gallium compounds; power HEMT; power semiconductor switches; wide band gap semiconductors; GaN-Si; Jedec standards; Si; blocking voltage; efficiency 99 percent; extended SOA tests; first generation GaN-on-Si power switching transistors; hard-switched bridge circuits; high power operation; high-electron mobility-transistors; junction temperature; loss reduction; lower on-resistance; reduced input-output charges; switching speed; temperature 175 degC; temperature 187 degC; temperature 215 degC; transistor performance; transistor robustness; very-low degradation rate; voltage 600 V; Gallium nitride; HEMTs; Junctions; Logic gates; Pulse width modulation; Silicon; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695551
  • Filename
    6695551