• DocumentCode
    662684
  • Title

    Analyzing losses using junction temperature of 300V 2.4kW 96% efficient, 1MHz GaN synchronous boost converter

  • Author

    Hughes, Brian ; Lazar, Josef ; Hulsey, Stephen ; Garrido, Austin ; Zehnder, Daniel ; Musni, Marcel ; Rongming Chu ; Boutros, Karim

  • Author_Institution
    HRL Labs. LLC, Malibu, CA, USA
  • fYear
    2013
  • fDate
    27-29 Oct. 2013
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    New techniques for measuring and analyzing losses in GaN power converters are presented. A 2.4kW synchronous boost converter, switching 300V at 1MHz with normally-off, AlN-base gate, AlGaN/GaN HFETs [1], serves as a vehicle to substantiate the results. An infrared camera is utilized to accurately measure temperatures of the upper and lower switches, as a function of switched current. These temperature measurements are correlated to loss in the respective switches, utilizing temperature data obtained via DC loss measurements. The higher temperature observed in the lower switch results from the switching loss in that switch, and is clearly evident in the thermal images. Analysis of the temperature dependence exposes the loss due to dynamic on-resistance and the switching loss. The extracted parameters accurately model both the efficiency and junction temperatures versus switching current.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; loss measurement; switching convertors; wide band gap semiconductors; AIGaN/GaN HFET; AlGaN-GaN; DC loss measurements; GaN power converters; dynamic on-resistance; efficiency 96 percent; frequency 1 MHz; infrared camera; junction temperature; lower switches; power 2.4 kW; switched current; switching loss; synchronous boost converter; temperature dependence; upper switches; voltage 300 V; Calibration; Dielectrics; Gallium nitride; Logic gates; Silicon; Thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
  • Conference_Location
    Columbus, OH
  • Type

    conf

  • DOI
    10.1109/WiPDA.2013.6695579
  • Filename
    6695579