DocumentCode :
662689
Title :
Diamond bipolar device simulation
Author :
Marechal, A. ; Rouger, N. ; Crebier, Jean-Christophe ; Pernot, J. ; Koizumi, S. ; Teraji, T. ; Gheeraert, E.
Author_Institution :
Inst NEEL, Univ. Grenoble Alpes, Grenoble, France
fYear :
2013
fDate :
27-29 Oct. 2013
Firstpage :
151
Lastpage :
154
Abstract :
Diamond is not only known for being the hardest gemstone but also for being the semiconductor having the highest calculated figures of merit (FOM). This comes from the unique physical properties of this material. Thus, it is predicted that diamond should exceeds silicon carbide (SiC) and galium nitride (GaN) in terms of low loss device and better compromises for on-state resistance versus breakdown voltage. However, in practice the applications of diamond devices are still limited and the performances are still not reaching the theoretical predictions. The question is then how to predict and evaluate diamond device performances themselves and in their environment. One of the possible answer is by using finite element based softwares. Few reports exist on unipolar diamond device modeling, and none on diamond bipolar device. The main limitations come from the lack of parameters implemented in the simulation tools together with the difficulties for modeling wide band gap semiconductor, i.e. extremely low carrier concentrations. In this study, we present the results on the first simulation of a diamond bipolar junction transistor electrical characteristics. The validation of the simulation is the first step towards the prediction of the architecture and behavior of future diamond devices.
Keywords :
bipolar transistors; diamond; elemental semiconductors; semiconductor device models; wide band gap semiconductors; C; carrier concentrations; diamond bipolar device simulation; diamond bipolar junction transistor electrical characteristics; finite element based softwares; simulation tools; wide band gap semiconductor; Diamonds; Erbium; Gallium nitride; Performance evaluation; Semiconductor process modeling; Silicon; Thickness measurement; Numerical simulation; TCAD software; diamond bipolar device;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wide Bandgap Power Devices and Applications (WiPDA), 2013 IEEE Workshop on
Conference_Location :
Columbus, OH
Type :
conf
DOI :
10.1109/WiPDA.2013.6695584
Filename :
6695584
Link To Document :
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