DocumentCode :
66301
Title :
Temporal Stability of Y–Ba–Cu–O Nano Josephson Junctions from Ion Irradiation
Author :
Cybart, Shane A. ; Roediger, P. ; Ke Chen ; Parker, J.M. ; Cho, Ethan Y. ; Wong, T.J. ; Dynes, Robert C.
Author_Institution :
Mater. Sci. Div., Lawrence Berkeley Nat. Lab., Berkeley, CA, USA
Volume :
23
Issue :
3
fYear :
2013
fDate :
Jun-13
Firstpage :
1100103
Lastpage :
1100103
Abstract :
We investigate the temporal stability of YBa2Cu3 O7-δ Josephson junctions created by ion irradiation through a nanoscale implant mask fabricated using electron beam lithography and reactive ion etching. A comparison of current-voltage characteristics measured for junctions after fabrication and eight years of storage at room temperature show a slight decrease in critical current and increase in normal state resistance consistent with broadening of the weak link from diffusion of defects. Shapiro step measurements performed eight years after fabrication reveal that device uniformity is maintained and is strong evidence that these devices have excellent temporal stability for applications.
Keywords :
Josephson effect; barium compounds; electrical resistivity; electron beam lithography; high-temperature superconductors; ion beam effects; masks; sputter etching; yttrium compounds; Shapiro step measurements; Y-Ba-Cu-O nanoJosephson junctions; YBa2Cu3O7-δ; critical current; current-voltage characteristics; defect diffusion; device uniformity; electron beam lithography; ion irradiation; nanoscale implant mask; normal state resistance; reactive ion etching; temporal stability; weak link broadening; Current measurement; Electrical resistance measurement; Fabrication; Josephson junctions; Junctions; Temperature measurement; Yttrium barium copper oxide; Ion implantation; Josephson junctions; nanolithography; yttrium barium copper oxide;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2012.2227646
Filename :
6353171
Link To Document :
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