• DocumentCode
    663040
  • Title

    A polymer neural probe with tunable flexibility

  • Author

    Ejserholm, Fredrik ; Vastesson, A. ; Haraldsson, Tommy ; van der Wijngaart, W. ; Schouenborg, Jens ; Wallman, Lars ; Bengtsson, Martin

  • Author_Institution
    Dept. of Meas. Technol. & Ind. Electr. Eng., Lund Univ., Lund, Sweden
  • fYear
    2013
  • fDate
    6-8 Nov. 2013
  • Firstpage
    691
  • Lastpage
    694
  • Abstract
    A novel polymeric material, off-stoichiometry thiol-ene-epoxy (OSTE+), has been evaluated for the fabrication of neural implants. OSTE+ is easily photo-structurable and exhibits mechanical properties suitable for stable implantation of the probe into brain tissue, while being sufficiently soft at physiological temperatures to reduce living tissue damage. The facile processing of OSTE+ allows use in applications where SU-8 or polyimide currently are the materials of choice. Uniquely, OSTE+ has a Young´s modulus of 1.9 GPa at 10 °C decreasing almost two orders of magnitude to 30 MPa at 40 °C, which can be compared to the Young´s modulus of 2.1 GPa for SU-8. We show a probe, with nine gold electrode sites, implanted into 0.5% agar at 40 °C using active cooling during the implantation.
  • Keywords
    Young´s modulus; biomedical electrodes; biomedical materials; brain; cooling; electrochemical electrodes; neurophysiology; photochemistry; polymer structure; prosthetics; stoichiometry; tissue engineering; Au; SU-8; Young´s modulus; active cooling; agar; brain tissue; gold electrode sites; living tissue damage; mechanical properties; neural implant fabrication; off-stoichiometry thiol-ene-epoxy; photostructural properties; physiological temperatures; polyimide; polymer neural probe; polymeric material; temperature 10 degC; temperature 40 degC; tunable flexibility; Gold; Implants; Mechanical factors; Polymers; Probes; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering (NER), 2013 6th International IEEE/EMBS Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-3546
  • Type

    conf

  • DOI
    10.1109/NER.2013.6696028
  • Filename
    6696028