DocumentCode
663076
Title
Integrated reliability modules used in an implantable wireless EMG sensor
Author
DeMichele, Glenn A. ; Hu Zhe ; Troyk, Philip R.
Author_Institution
Sigenics Inc., Chicago, IL, USA
fYear
2013
fDate
6-8 Nov. 2013
Firstpage
847
Lastpage
850
Abstract
Long-term reliability of an implanted system is an implicit requirement. The catastrophic failure of an implanted device is often the only indication that reliability expectations have not been met. In the design of a wireless EMG sensor, we have integrated three “Reliability Modules” specifically designed to monitor the state of the silicon integrated circuit and its environment.
Keywords
CMOS integrated circuits; electromyography; elemental semiconductors; semiconductor device reliability; silicon; wireless sensor networks; Si; catastrophic failure; implantable wireless EMG sensor; implanted device; implanted system; integrated reliability modules; long-term reliability; reliability expectations; silicon integrated circuit; Electromyography; Implants; Moisture; Reliability; Silicon; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Neural Engineering (NER), 2013 6th International IEEE/EMBS Conference on
Conference_Location
San Diego, CA
ISSN
1948-3546
Type
conf
DOI
10.1109/NER.2013.6696067
Filename
6696067
Link To Document