Title :
Integrated reliability modules used in an implantable wireless EMG sensor
Author :
DeMichele, Glenn A. ; Hu Zhe ; Troyk, Philip R.
Author_Institution :
Sigenics Inc., Chicago, IL, USA
Abstract :
Long-term reliability of an implanted system is an implicit requirement. The catastrophic failure of an implanted device is often the only indication that reliability expectations have not been met. In the design of a wireless EMG sensor, we have integrated three “Reliability Modules” specifically designed to monitor the state of the silicon integrated circuit and its environment.
Keywords :
CMOS integrated circuits; electromyography; elemental semiconductors; semiconductor device reliability; silicon; wireless sensor networks; Si; catastrophic failure; implantable wireless EMG sensor; implanted device; implanted system; integrated reliability modules; long-term reliability; reliability expectations; silicon integrated circuit; Electromyography; Implants; Moisture; Reliability; Silicon; Temperature measurement; Temperature sensors;
Conference_Titel :
Neural Engineering (NER), 2013 6th International IEEE/EMBS Conference on
Conference_Location :
San Diego, CA
DOI :
10.1109/NER.2013.6696067
