Chip-scale packaging for bioelectronic implants

Next generation miniaturized bioelectronic implants will require improved hermetic packaging technology to achieve the system requirements for treating complex neurological conditions. We describe herein three key advances towards enabling chip-scale packaging for bioelectronic implants. First, we demonstrate multilayer, multi-material films that have improved barrier properties to contaminating ions and can be deposited conformally on three-dimensional structures. Second, we characterize integrated sensors capable of detecting contaminants, to serve both as tests of deposited coating hermeticity and as an early warning system to predict implant failure. Third, a high-density hermetic feedthrough is described that will enable long-term deployment of state-of-the-art neural interface arrays. Collectively, this work represents a significant advance in packaging technologies for medical implants.