• DocumentCode
    663101
  • Title

    Implantable neural device integrated with regenerative scaffold for neural signal sensing from damaged spinal cord

  • Author

    Jinwoo Jeong ; Taehyung Kim ; Sungmin Han ; Inchan Youn ; Suh, Jun-Kyo Francis ; Jinseok Kim

  • Author_Institution
    Korea Inst. of Sci. & Technol., Seoul, South Korea
  • fYear
    2013
  • fDate
    6-8 Nov. 2013
  • Firstpage
    949
  • Lastpage
    952
  • Abstract
    A novel neural device that is a combination of the hydrogel scaffold for regeneration and neural electrode for signal acquisition methods is suggested and fabricated to sense the signal from the damaged spinal cord. The sieve-type electrodes have been designed into a semicircle shape to be fit to a hemisection lesion model of an in-vivo implant animal model. A total of six ring-shaped electrodes are arrayed with a pitch of 600μιη and via holes with a diameter of 200μιη. Exactly overlapping the ring electrode with the neural electrode to the channels of axonal regeneration in the nerve regeneration scaffold is the most important task during the integration process of the scaffold and sieve electrode. The neural electrode was fabricated on polyimide of 30μιη thickness, and has 6 circular sieve electrodes, which have an average impedance of 17.9kΩ at 1kHz.
  • Keywords
    biomedical electrodes; hydrogels; medical signal detection; medical signal processing; neural nets; neurophysiology; prosthetics; tissue engineering; average impedance; axonal regeneration channels; circular sieve electrodes; damaged spinal cord; hemisection lesion model; hydrogel; implantable neural device; in-vivo implant animal model; nerve regeneration scaffold; neural electrode; neural signal sensing; polyimide thickness; regenerative scaffold; ring-shaped electrodes; scaffold-sieve electrode integration process; signal acquisition methods; Electrodes; Lesions; Metals; Polyimides; Shape; Spinal cord; Tissue engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering (NER), 2013 6th International IEEE/EMBS Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-3546
  • Type

    conf

  • DOI
    10.1109/NER.2013.6696092
  • Filename
    6696092