DocumentCode
664432
Title
A half-kW capable 28-V LDMOS RF power transistor in a small-footprint package
Author
Wang, Lingfeng ; Rueda, Hoover ; Brakensiek, W. ; Dragon, C. ; Foxx, K.
Author_Institution
Freescale Semicond. Inc., Tempe, AZ, USA
fYear
2013
fDate
2-7 June 2013
Firstpage
1
Lastpage
3
Abstract
This paper presents a half-kW capable 28-V LDMOS single-ended RF power transistor designed in an air cavity ceramic package for 2.1 GHz applications. Compared to other existing products in the market with similar power levels, this transistor has its package size reduced by ~30% and demonstrates to date the highest power density per unit area in industry. The transistor has been designed using the latest generation of Freescale´s Airfast™ 28-V LDMOS technology. The novel gate engineering applied in this generation enables 2 dB higher gain than its precedent while retaining excellent efficiency, linearity and power density. A Class-AB power amplifier is designed with the transistor for optimized output power and gain flatness in the 2.11-2.17 GHz band. It delivers 426 watts of P3dB power with 18.3 dB maximum gain.
Keywords
ceramic packaging; power MOSFET; power amplifiers; power transistors; Freescale Airfast; LDMOS technology; air cavity ceramic package; class-AB power amplifier; frequency 2.1 GHz; gain flatness; gate engineering; half-kW capable LDMOS single-ended RF power transistor; output power; package size; power density; power levels; small-footprint package; voltage 28 V; Gain; Logic gates; Performance evaluation; Power amplifiers; Power generation; Radio frequency; Transistors; LDMOS; high power; power amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location
Seattle, WA
ISSN
0149-645X
Print_ISBN
978-1-4673-6177-4
Type
conf
DOI
10.1109/MWSYM.2013.6697441
Filename
6697441
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