• DocumentCode
    664495
  • Title

    A novel design method of concurrent dual-band power amplifiers including impedance tuning at inter-band modulation frequencies

  • Author

    Xiaofan Chen ; Wenhua Chen ; Ghannouchi, Fadhel M. ; Zhenghe Feng

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A novel design method of concurrent dual-band power amplifiers (PAs) including impedance tuning at inter-band modulation (IM) frequencies is proposed in this paper. It´s shown that the impedances exhibited to the transistor at IM frequencies can affect the performance of a concurrent PA significantly. Thus it is very essential to take IM impedances into account, which can be referred to as IM impedance manipulation, or IM tuning for short. An example concurrent dual-band 1.92.6GHz PA is designed using the proposed method and a conventional concurrent dual-band PA not considering IM tuning is also designed for the purpose of comparison. Designed with a 10-Watts GaN HEMT, the proposed PA exhibits about 11 Watts output power and higher than 72.8% drain efficiency when driven equally by concurrent CW stimulus. To our best knowledge, this is the state-of-the-art performance of concurrent dual-band PA, and it´s the first reported concurrent PA with IM tuning.
  • Keywords
    III-V semiconductors; circuit tuning; gallium compounds; high electron mobility transistors; integrated circuit design; power amplifiers; wide band gap semiconductors; GaN; HEMT; IM impedance manipulation; IM tuning; bandwidth 1.9 GHz to 2.6 GHz; concurrent dual band power amplifiers; impedance tuning; interband modulation frequencies; power 10 W; Design methodology; Dual band; Harmonic analysis; Impedance; Impedance matching; Power amplifiers; Tuning; GaN; concurrent; dual-band; power amplifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697505
  • Filename
    6697505