A broadband interconnect for THz heterogeneous system integration

Author

Chun-Hsing Li ; Jan-Jr Wu ; Chien-Nan Kuo ; Yu-Ting Cheng ; Ming-Ching Kuo

Author_Institution

Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

fYear

2013

fDate

2-7 June 2013

Firstpage

1

Lastpage

4

Abstract

A broadband interconnect for THz heterogeneous system integration is proposed using a resonator coupling technique. Two resonators, deployed on a chip and a carrier, respectively, are coupled through the electromagnetic field to provide a low-loss interconnect in a broadband manner. Simulation results indicate an insertion loss of 0.32 dB at 170 GHz while covering 3-dB bandwidth from 100 to 344 GHz. Measurement can be conducted to verify its performance only from 140 GHz to 220 GHz, due to equipment limit. The measured minimum insertion loss is 0.47 dB at 164 GHz.

Keywords

electromagnetic fields; microwave resonators; THz heterogeneous system integration; bandwidth 100 GHz to 344 GHz; broadband interconnect; electromagnetic field; frequency 140 GHz to 220 GHz; frequency 164 GHz; frequency 170 GHz; insertion loss; low-loss interconnect; resonator coupling technique; Broadband communication; Couplings; Impedance matching; Insertion loss; Integrated circuit interconnections; Loss measurement; Transmission line measurements; Broadband; THz; heterogeneous integration; interconnect;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International

Conference_Location

Seattle, WA

ISSN

0149-645X

Print_ISBN

978-1-4673-6177-4

Type

conf

DOI

10.1109/MWSYM.2013.6697545

Filename

6697545