Title :
Microstrip to buried waveguide probe feeds for V- and W-band in LTCC technology
Author :
Ocket, I. ; De Raedt, W. ; Nauwelaers, B.
Author_Institution :
Interuniv. Microelectron. Centre, Leuven, Belgium
Abstract :
This paper reports on V- and W-band uniplanar probe feeds from microstrip to buried substrate integrated waveguide (SIW) in LTCC technology. For the V- and W-band designs respectively, the measured mid-band insertion loss is 0.24 dB and 0.47 dB with relative bandwidths of 40% and 27 %. The measured average waveguide attenuation is 0.057 dB/mm for V-band and 0.15 dB/mm for W-band. These feeds enable very compact integration of low-loss antenna feed networks, LO distribution networks, etc.
Keywords :
antenna feeds; microstrip lines; microstrip transitions; substrate integrated waveguides; V-band LTCC technology; W-band LTCC technology; loss 0.24 dB; loss 0.47 dB; low temperature cofired ceramics; low-loss antenna feed; microstrip-buried waveguide probe feeds; substrate integrated waveguide; uniplanar probe feed; Attenuation; Feeds; Insertion loss; Microstrip; Microwave theory and techniques; Probes; Waveguide transitions; Antenna feeds; ceramics; electronics packaging; microstrip antenna arrays; millimeter wave technology; passive circuits; planar arrays; waveguide junctions;
Conference_Titel :
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6177-4
DOI :
10.1109/MWSYM.2013.6697562
