• DocumentCode
    664572
  • Title

    A finite 3D field simulation method for permittivity gradient implementation of a novel porosification process in LTCC

  • Author

    Talai, Armin ; Steinhauser, Frank ; Schmid, Ulrich ; Weigel, Robert ; Bittner, Achim ; Koelpin, Alexander

  • Author_Institution
    Inst. for Electron. Eng., Friedrich-Alexander-Univ. Erlangen-Nuremberg, Erlangen, Germany
  • fYear
    2013
  • fDate
    2-7 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    High frequency substrates show a manifold variety of complex permittivities for different applications. Recent research results demonstrated the possibility of local decrease of the permittivity on LTCC by chemical etching processes, which enables the design of high quality antennas on LTCC. This paper shows a novel approach on the determination of the quantitative reduction of the effective permittivity by scanning electron microscope analyses in combination with finite 3D field simulations of the resulting inhomogeneous material. By the characterization of two different porosified LTCCs it could be shown that this process is suitable for direct antenna integration on glass-ceramic substrates with enhanced values of relative permittivities.
  • Keywords
    ceramics; permittivity; scanning electron microscopes; LTCC; chemical etching processes; complex permittivities; direct antenna integration; finite 3D field simulation method; finite 3D field simulations; glass ceramic substrates; high frequency substrates; high quality antennas; inhomogeneous material; low temperature cofired ceramics; manifold variety; permittivity gradient implementation; porosification process; scanning electron microscope analysis; Copper; Materials; Microstrip; Permittivity; Field simulation; LTCC; inhomogeneous substrate; local reduction of permittivity; permittivity gradient; porosification; wet chemical etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
  • Conference_Location
    Seattle, WA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4673-6177-4
  • Type

    conf

  • DOI
    10.1109/MWSYM.2013.6697583
  • Filename
    6697583