Title :
Millimeter-wave multi-chip module for GaN MMIC transceivers fabricated using multilayer ceramics technology
Author :
Masuda, Shin ; Yamada, Makoto ; Kamada, Yoichi ; Ozaki, S. ; Makiyama, Kozo ; Okamoto, N. ; Imanishi, Kenji ; Kikkawa, Takamaro ; Shigematsu, Hisao
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
Abstract :
This paper presents a multi-chip module (MCM) suitable for GaN monolithic microwave integrated circuit transceivers. The MCM has an embedded heat sink and novel radio frequency interface structure fabricated using multilayer ceramics technology. The novel interface widens the bandwidth and improves insertion loss operating up to millimeter-wave frequencies. A fabricated transceiver MCM occupying only 12 × 36 mm2 is also demonstrated with a GaN power amplifier.
Keywords :
III-V semiconductors; MMIC; ceramic packaging; gallium compounds; heat sinks; millimetre wave power amplifiers; multichip modules; radio transceivers; GaN; GaN MMIC transceivers; GaN monolithic microwave integrated circuit transceivers; GaN power amplifier; MCM; embedded heat sink; millimeter-wave frequencies; multichip module; multilayer ceramics technology; novel radio frequency interface structure; Ceramics; Frequency measurement; Gallium nitride; Heat sinks; MMICs; Millimeter wave technology; Radio frequency; GaN; MCM; MMIC; millimeter-wave; power amplifiers;
Conference_Titel :
Microwave Symposium Digest (IMS), 2013 IEEE MTT-S International
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4673-6177-4
DOI :
10.1109/MWSYM.2013.6697771
