DocumentCode
665273
Title
Table of contents
fYear
2013
fDate
9-12 Sept. 2013
Firstpage
1
Lastpage
15
Abstract
The following topics are dealt with: 2.5 packages; 3D packages; interconnections; wafer level packaging; MEMS; modules; sensor; design for functionality; design for reliability; thermal modelling; mechanical modelling; electrical modelling; biomedical sensors; flip-chip interconnections; and space applications.
Keywords
biosensors; flip-chip devices; micromechanical devices; wafer level packaging; 2.5 packages; 3D packages; MEMS; biomedical sensors; design for functionality; design for reliability; electrical modelling; flip-chip interconnections; mechanical modelling; modules; space applications; thermal modelling; wafer level packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Packaging Conference (EMPC) , 2013 European
Conference_Location
Grenoble
Type
conf
Filename
6698589
Link To Document