Title :
Board level reliability testing of hermetic packages equipped with high-rel interconnection solutions and dedicated to space applications
Author :
Gaillard, Olivier
Author_Institution :
e2v Semicond., St. Egrève, France
Abstract :
e2v semiconductors has received worldwide renowned recognition for supplying high speed Broadband Data Converters for a multitude of leading-edge signal conversion applications. If special attention is paid to the development and optimization of the products electrical specifications, packaging and board reliability performances are expected to be of the same caliber. With this in mind, 2012 has seen e2v investigate new interconnection solutions as part of a study into board level reliability. Three different high-end interconnection solutions have been explored, including copper-reinforced solder columns and polymer-cored solder balls. The board reliability study has been conducted per IPC-9701 and ECSS-Q-ST-70-38C standards. 1500 temperature cycles have been performed in the range of -55°C to 100°C and continuous electrical monitoring of the test vehicles has been conducted as well as continuous temperature monitoring. A routine reading of each components resistance was carried out every 30 seconds. e2v´s paper will compare the behavior of Ceramic Grid Array (CGA) packages equipped with Solder Column Interposers (SCI) to CGAs equipped with SIX SIGMA columns as well as Micropearl-SOL Polymer balls. In particular, the document will highlight the reliability testing results for the Al2O3 Ceramic Grid Array technology when soldered on FR4 printed circuit boards and submitted to space-applications-oriented temperature cycles. High Power Light Microscopy (HPLM) and Scanning Electron Microscope (SEM) images as well as compositional data gathered from micro-section analyses of solder joints will be provided.
Keywords :
ball grid arrays; ceramic packaging; hermetic seals; integrated circuit reliability; printed circuit testing; printed circuits; six sigma (quality); solders; CGA packages; Micropearl-SOL polymer balls; SCI; SEM images; SIX SIGMA columns; board level reliability testing; board reliability performances; caliber; ceramic grid array technology; components resistance; continuous electrical monitoring; continuous temperature monitoring; copper reinforced solder columns; e2v semiconductors; electrical specifications; hermetic packages; high power light microscopy; high speed broadband data converters; high-rel interconnection solutions; leading edge signal conversion applications; microsection analysis; polymer cored solder balls; printed circuit boards; routine reading; scanning electron microscope; solder column interposers; solder joints; space applications; test vehicles; Ceramics; Integrated circuit interconnections; Integrated circuit reliability; Six sigma; Standards; Substrates; Board Level Reliability; Ceramic Ball Grid Array (CBGA); Solder Columns; Solder Joint Quality; Space Applications; Temperature Cycle Test;
Conference_Titel :
Microelectronics Packaging Conference (EMPC) , 2013 European
Conference_Location :
Grenoble