DocumentCode
665299
Title
Embedded capacitor design rules in multilayer organic-based substrate for HF circuits
Author
Wade, Mark ; Bord-Majek, Isabelle ; Dubois, T. ; Duchamp, G.
Author_Institution
IMS Lab., Univ. of Bordeaux, Talence, France
fYear
2013
fDate
9-12 Sept. 2013
Firstpage
1
Lastpage
6
Abstract
Embedded capacitor technology has a great potential for improved electrical performances, assembly cost reduction and the circuits reliability increase for high frequencies applications. This article describes the behavior of embedded capacitors and studies the design rules in a wide frequency band. In a first time, a simple planar capacitor of (1*1) cm2 surface is designed and simulated by 2.5D and 3D field solver software Momentum and HFSS respectively, in the range of 10 MHz to 1.2 GHz. The latter is compared by measurements results and shows a good agreement on the resonant frequency values (10%). In a second step, from the validated model, two 3D structures using capacitors sizes (1*1) mm2 are studied in the band of 1 MHz to 10 GHz. In parallel, the electrical equivalent models of these structures are released by the ADS software. A smaller difference in resonant frequency (20%) is obtained to results simulations of 3D and electrical models. Finally, electromagnetic (EM) simulations on various geometries of capacitors for same surface electrodes and for buried structures, give a resonant frequency around 1.7 GHz.
Keywords
capacitors; circuit reliability; cost reduction; electrodes; equivalent circuits; printed circuit design; 2.5D field solver software; 3D field solver software; ADS software; HF circuits; HFSS; Momentum; assembly cost reduction; buried structures; circuit reliability; electrical equivalent models; embedded capacitor design rules; frequency 1.7 GHz; frequency 10 MHz to 1.2 GHz; multilayer organic-based substrate; planar capacitor; surface electrodes; Capacitors; Electrodes; Geometry; Impedance; Inductance; Integrated circuit modeling; Resonant frequency; Embedded capacitors; PCB; design rules; equivalent circuit; modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Packaging Conference (EMPC) , 2013 European
Conference_Location
Grenoble
Type
conf
Filename
6698617
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