• DocumentCode
    665313
  • Title

    Improvement of low-temperature sintered ink containing nano-Ag for ink-jet printing of conductive structures on flexible substrates

  • Author

    Felba, Jan ; Smolarek, A. ; Moscicki, A. ; Falat, Tomasz ; Zawierta, M. ; Zaluk, Zbigniew

  • Author_Institution
    Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
  • fYear
    2013
  • fDate
    9-12 Sept. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The ink-jet printing is a noncontact technique for production electrically conductive structures, also on flexible substrates. The greatest challenge is the conductive material for printing - the ink, because it influences the parameters of printed structures. The structures are nonconductive just after the printing and to obtain good electrical conductivity, they need an additional energy, mainly supplied during a heating process. Our aim is to produce the ink containing silver particles with the size dimension at the level of tens of nanometers without the nano-Ag particles aggregation and sedimentation phenomenon, which can be used for ink-jet printing on a cheap, flexible substrates with thermal resistance not higher than 150 oC. Additionally the ink can be improved by proper choice of nano-Ag manufacture process. It was done by the planning the experiment (Design of Experiment) and analysis of variance (ANOVA).
  • Keywords
    design of experiments; electrical conductivity; flexible electronics; ink jet printing; nanoparticles; silver; sintering; thermal resistance; ANOVA; Ag; analysis of variance; conductive structures; design of experiment; electrical conductivity; flexible substrates; ink jet printing; low-temperature sintered ink; nanoparticles; particles aggregation; sedimentation phenomenon; temperature 150 degC; thermal resistance; Ink jet printing; Polyimides; Printing; Resistance; Silver; Substrates; Design of Experiment; flexible electronics; ink-jet printing; nanosilver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics Packaging Conference (EMPC) , 2013 European
  • Conference_Location
    Grenoble
  • Type

    conf

  • Filename
    6698631