Toward a reliability analysis method of wide band gap power electronic components and modules

Author

Parent, Guillaume ; Massiot, Gregor ; Rouet, Vincent ; Munier, C. ; Vidal, P.-E. ; Carrillo, Francisco

Author_Institution

EADS Innovation Works, Suresnes, France

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

6

Abstract

This study is addressing on the reliability of COTS (Commercial Off-The-Shelf) power electronic components and modules which could be used in high reliability systems such as aerospace systems. This paper details the first followed steps to achieve a reliability assessment of some COTS power devices. These first steps are: Construction analyses for the determination of the packaging assembly technologies of COTS power devices; Discussion on the material used in COTS power devices; Synthesis of the potential failure risk analysis under harsh environments; Determination of several accelerated ageing tests to check the potential failure modes and mechanisms in power electronic for aerospace systems.

Keywords

ageing; assembling; avionics; failure analysis; life testing; modules; power electronics; reliability; risk analysis; COTS power devices; accelerated ageing tests; aerospace systems; commercial off-the-shelf; packaging assembly technology; potential failure risk analysis; power electronic modules; reliability analysis method; reliability assessment; wide band gap power electronic components; Absorption; Materials; Metallization; Silicon carbide; Tin; Wires; COTS; Reliability; assembly technology; construction analyses; power electronic components and modules;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698650