Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

Author

Vandevelde, B. ; Van Kerckhove, Matthias ; Degryse, Dominiek ; D´Haese, Wim ; Schaubroeck, David ; Allaert, Bart ; Geerinckx, Eddy ; Lauwaert, Ralph ; Willems, Geert

Author_Institution

Imec, Leuven, Belgium

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

5

Abstract

Fracture of Intermetallic Compounds (IMC) under mechanical shock is a major concern for soldered components. While most shock tests are performed under shear load, a specially designed sample setup is designed and fabricated allowing testing under axial pull direction. These samples are fabricated with two pad finish - NiAu and SAC HASL - and comparing solder mask versus non-solder-mask pad defined solder joints. A mini scale of the Charpy equipment setup measures the energy taken up by the solder joints before fracture. The impact of thermal ageing on the shock resistance is also investigated.

Keywords

ageing; brittle fracture; integrated circuit interconnections; nickel alloys; solders; Charpy equipment setup; IMC; NiAu; SAC HASL; axial pull direction; fracture; intermetallic compounds; lead-free solder joints; mechanical shock; pad finish; shock resistance; shock tests; solder mask; soldered components; thermal ageing; Aging; Electric shock; Electrical resistance measurement; Nickel; Resistance; Soldering; Tin; HASL and NiAu pad finish; IMC fracture; mechanical shock resistance; thermal ageing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698656