Bridging the infrastructure gap between traditional wire-bond and TSV semiconductor package technology

The challenge for today´s mobile devices is that they will all be expected to support more advanced graphics processing. And to reinforce this factor the industry requires an exponential increase in processor-to-memory bandwidth. This paper will introduce two innovative semiconductor package technologies designed to address these challenges; the Bond-Via-Array (BVA™) package and Duel and Quad Face Down (xFD™) memory package. The BVA package is an ultra high-IO Package-on-Package (PoP) solution that significantly increases bandwidth to enable current and future smartphone and tablet features and the xFD package assembly process, furnishes a very low profile stacked-die memory variation developed for next generation high performance DRAM.