Bridging the infrastructure gap between traditional wire-bond and TSV semiconductor package technology

Author

Solberg, Vern ; Haba, Belgacem ; Zohni, Wael ; Mohammed, Ilyas

Author_Institution

Invensas Corp., San Jose, CA, USA

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

6

Abstract

The challenge for today´s mobile devices is that they will all be expected to support more advanced graphics processing. And to reinforce this factor the industry requires an exponential increase in processor-to-memory bandwidth. This paper will introduce two innovative semiconductor package technologies designed to address these challenges; the Bond-Via-Array (BVA™) package and Duel and Quad Face Down (xFD™) memory package. The BVA package is an ultra high-IO Package-on-Package (PoP) solution that significantly increases bandwidth to enable current and future smartphone and tablet features and the xFD package assembly process, furnishes a very low profile stacked-die memory variation developed for next generation high performance DRAM.

Keywords

DRAM chips; integrated circuit packaging; lead bonding; three-dimensional integrated circuits; BVA package; DRAM; PoP solution; TSV semiconductor package technology; advanced graphics processing; bond-via-array package; duel and quad face down memory package; high-IO package-on-package solution; infrastructure gap; mobile devices; processor-to-memory bandwidth; traditional wire-bond; xFD memory package; Assembly; Integrated circuit interconnections; Packaging; Random access memory; Stacking; Substrates; Wires; Bond Via Array; Dual Face-Down Memory; Package-on-Package; Quad Face-Down Memory;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698657