Title :
Technological investigation of LTCC-based Micro-Electro-Mechanical Systems (MEMS) to improve reliability and accuracy
Author :
Lenz, Claus ; Ziesche, Steffen ; Partsch, Uwe ; Neubert, Holger
Author_Institution :
Hybrid Microsyst., Fraunhofer Inst. for Ceramic Technol. & Syst., Dresden, Germany
Abstract :
The Low Temperature Co-fired Ceramics (LTCC) process is a promising technology for the production of innovative Micro-Electro-Mechanical Systems (MEMS). However, a deep understanding of this technology, in order to achieve a high production yield, accuracy and reliability, is required. Subject of this study is to investigate the shrinkage and material properties of differently structured LTCC substrates based on the material system GT951 as a function of various technological fabrication parameters. The intention behind is to control the behavior of the MEMS component precisely during the different steps of the manufacturing process.
Keywords :
ceramic packaging; micromechanical devices; semiconductor device manufacture; semiconductor device reliability; shrinkage; GT951; LTCC process; LTCC substrates; LTCC-based microelectro-mechanical systems; MEMS component; low temperature co-fired ceramics process; manufacturing process; material property; material system; production yield; reliability; shrinkage; technological fabrication parameters; technological investigation; Fabrication; Lamination; Micromechanical devices; Nonhomogeneous media; Substrates; Young´s modulus; Force Sensor; LTCC; MEMS; Yield;
Conference_Titel :
Microelectronics Packaging Conference (EMPC) , 2013 European
Conference_Location :
Grenoble
