Technological investigation of LTCC-based Micro-Electro-Mechanical Systems (MEMS) to improve reliability and accuracy

Author

Lenz, Claus ; Ziesche, Steffen ; Partsch, Uwe ; Neubert, Holger

Author_Institution

Hybrid Microsyst., Fraunhofer Inst. for Ceramic Technol. & Syst., Dresden, Germany

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

6

Abstract

The Low Temperature Co-fired Ceramics (LTCC) process is a promising technology for the production of innovative Micro-Electro-Mechanical Systems (MEMS). However, a deep understanding of this technology, in order to achieve a high production yield, accuracy and reliability, is required. Subject of this study is to investigate the shrinkage and material properties of differently structured LTCC substrates based on the material system GT951 as a function of various technological fabrication parameters. The intention behind is to control the behavior of the MEMS component precisely during the different steps of the manufacturing process.

Keywords

ceramic packaging; micromechanical devices; semiconductor device manufacture; semiconductor device reliability; shrinkage; GT951; LTCC process; LTCC substrates; LTCC-based microelectro-mechanical systems; MEMS component; low temperature co-fired ceramics process; manufacturing process; material property; material system; production yield; reliability; shrinkage; technological fabrication parameters; technological investigation; Fabrication; Lamination; Micromechanical devices; Nonhomogeneous media; Substrates; Young´s modulus; Force Sensor; LTCC; MEMS; Yield;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698668