60GHz BGA solution packaging reliability and warpage study

At millimeter wave (MMW) frequencies, high data rate applications such as kiosk downloading or Wireless HDMI require low cost and low power Systems on Chip (SoC) to address mass-market products and consumer expectations. Along with the developments of 60 GHz chipset solutions, low-cost antennas and package costs are obviously key factors to succeed in large volumes consumer applications. High Density Interconnect (HDI) packaging technologies can be successfully utilized to address all these problematic. But reliability of such new packaging approach is also a key concern in order to propose complete solutions at industrial level. In this paper, we will most specifically highlight the high performance BGA technology solution in terms of reliability, resulting by SAM and electrical functional tests. The BGA is manufactured with the latest generation of low loss materials substrate for high electrical performance and good mechanical behavior. Antenna performances have been measured on a dedicated antenna measurement setup validating the design flow of the antennas in this packaging technology [1]. Reliability tests with relevant mechanical package warpage study and BLR simulations comparing substrate designs evolution have been done on the BGA allied with a 65nm CMOS silicon technology die flip-chipped on it. The package reliability tests realized are consumer oriented, mainly JEDEC level 3 preconditioning followed by thermal cycles and thermal humidity test. Functional tests of the application have also been performed. A 60 GHz wireless link between a receiver and a transmitter using the 60 GHz BGA mounted on a PCB has been successfully established in an office-like environment over one meter range.