Integration of capillary self-alignment for face to face micro bump bonding

Author

Pham, Ngao P. ; Daily, R. ; Armini, S. ; Delande, Tinne ; Pantouvaki, M. ; Soussan, P.

Author_Institution

Imec, Leuven, Belgium

fYear

2013

fDate

9-12 Sept. 2013

Firstpage

1

Lastpage

4

Abstract

This paper reports a face to face microbump bonding process using capillary self-alignment. The process uses water as a self-alignment medium. A SAM (self-assembled monolayers) coating was performed on the surface of the chip to create a hydophobic/hydrophilic area. A thin (150nm) Cu ring is formed on the surface of the chip, which can confine the alignment medium during the chip positioning process. Test chips have been flip-chip bonded with the self-alignment. The alignment and bonding result have been demonstrated via the resistance measurement of daisy chain 20 and 40μm pitch. 100% yield on 40μm pitch and almost full connectivity on 20 μm pitch chains have been obtained.

Keywords

flip-chip devices; integrated circuit bonding; integrated circuit packaging; monolayers; self-assembly; three-dimensional integrated circuits; water; Cu; SAM coating; capillary self-alignment; chip positioning process; face-to-face microbump bonding; flip-chip bonding; resistance measurement; self-assembled monolayers; size 150 nm; size 20 mum; size 40 mum; Assembly; Bonding; Face; Flip-chip devices; Self-assembly; Silicon compounds; Surface treatment; bonding; capillary; microbump; self-assembly;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronics Packaging Conference (EMPC) , 2013 European

Conference_Location

Grenoble

Type

conf

Filename

6698690