Title :
Integration of IEC 61850 and OPC UA for Smart Grid automation
Author :
SRINIVASAN, SUDARSHAN ; Kumar, Ravindra ; Vain, Juri
Author_Institution :
Int. Res. Lab., Kalasalingam Univ., Srivilliputtur, India
Abstract :
Smart grid (SG) is motivated to use information available in the power grid to increase the safety, reliability, and efficiency of the conventional power grid. Sophisticated control techniques using information are required for realizing SG. One major challenge is the presence of distributed heterogeneous components in SG requiring distribution of control functions. Automation intended should also support such distributed execution. One major challenge in the development of distributed control is the interoperability among devices from different manufacturers, and various conceptual entities in SG. Standardization is required for interoperability, and distributed control. IEC 61850 has emerged as the de facto standard in substation automation. On the other hand, OPC UA is being increasingly used in industrial automation. In this investigation, we illustrate the need for integration of data models following IEC 61850 and OPC UA for SG control and as enabler for new vistas like multi-agent systems, hierarchical control, and diagnosis and monitoring using suitable examples.
Keywords :
IEC standards; distributed control; electrical safety; power system reliability; smart power grids; substation automation; IEC 61850 standard; OPC UA; SG; distributed control; distributed heterogeneous component; hierarchical control; industrial automation; interoperability; multi-agent system; open process control unified architecture; power grid reliability; power grid safety; smart grid automation; substation automation; Automation; Data models; IEC standards; Multi-agent systems; Smart grids; Substations; IEC 61850; Open Process Control Unified Architecture (OPC UA); Smart Grid (SG); hierarchical control; multi-agent systems (MAS);
Conference_Titel :
Innovative Smart Grid Technologies - Asia (ISGT Asia), 2013 IEEE
Conference_Location :
Bangalore
Print_ISBN :
978-1-4799-1346-6
DOI :
10.1109/ISGT-Asia.2013.6698789