DocumentCode
665782
Title
AC power source based on series-connection between modular multilevel converter and linear power amplifier
Author
da Silva, Gabriel S. ; Beltrame, Rafael Concatto ; Martins, M.L.S. ; Schuch, L. ; Hey, H.L. ; Rech, Cassiano
Author_Institution
Power Electron. & Control Group - GEPOC, Fed. Univ. of Santa Maria - UFSM, Santa Maria, Brazil
fYear
2013
fDate
10-13 Nov. 2013
Firstpage
362
Lastpage
367
Abstract
This paper proposes a hybrid topology for ac power source (ACPS) application composed of a modular multilevel converter (MMC), operating as main amplifier, and a linear power amplifier (LPA), operating as correction amplifier. The MMC and LPA are associated in series. This way, it is possible to gather the modularity, reliability and higher efficiency provided by the MMC and the high waveform fidelity provided by the LPA. Additionally, it is possible to reproduce a voltage waveform with a high bandwidth and, differently from previous works, with a topology that requires a unique dc source for the main amplifier. The control of the MMC is implemented by controlling the inner current and the submodule capacitor voltages; meanwhile, the control of the LPA is responsible for defining the output voltage. Experimental results are presented to demonstrate the suitable performance of the proposed topology in terms of dynamic response, output waveform fidelity and efficiency.
Keywords
electric current control; power amplifiers; power capacitors; power convertors; voltage control; AC power source application; LPA; MMC; correction amplifier; dynamic response; inner current control; linear power amplifier; modular multilevel converter; output waveform fidelity; series-connection; submodule capacitor voltage control; voltage waveform reproduction; Bandwidth; Capacitors; Power amplifiers; Switches; Topology; Voltage control; Hybrid ac power source; modular multilevel converter; series configuration;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location
Vienna
ISSN
1553-572X
Type
conf
DOI
10.1109/IECON.2013.6699163
Filename
6699163
Link To Document