Title :
Electro-thermal modeling of SiC power devices for circuit simulation
Author :
Shan Yin ; Tao Wang ; Tseng, King-Jet ; Jiyun Zhao ; Xiaolei Hu
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
The behavior-based electro-thermal models for commercial SiC Schottky diode and SiC MOSFET have been developed for circuit simulator PSpice over a wide range of temperature. The Foster RC network is used for thermal modeling and coupled with the electrical modeling by the interaction between power loss and junction temperature. Based on the measurement and parameters extracted from datasheet, both static and dynamic models are formulated by curve fitting. Some simplifications are introduced during modeling to improve convergence and simulation speed. An all-SiC boost converter is also analyzed by simulation to evaluate the models.
Keywords :
MOSFET; SPICE; Schottky diodes; circuit simulation; curve fitting; power convertors; power semiconductor diodes; semiconductor device models; silicon compounds; Foster RC network; SiC MOSFET; SiC Schottky diode; SiC power device; all-SiC boost converter; circuit simulation; circuit simulator PSpice; curve fitting; dynamic model; electrothermal modeling; junction temperature; power loss; static model; Capacitance; Integrated circuit modeling; MOSFET; SPICE; Schottky diodes; Silicon carbide; Temperature; MOSFET; PSpice; Schottky diode; SiC; behavior modeling; electro-thermal;
Conference_Titel :
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location :
Vienna
DOI :
10.1109/IECON.2013.6699223