DocumentCode :
666032
Title :
Thermal analysis of two-level wind power converter under symmetrical grid fault
Author :
Dao Zhou ; Blaabjerg, Frede
Author_Institution :
Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
fYear :
2013
fDate :
10-13 Nov. 2013
Firstpage :
1904
Lastpage :
1909
Abstract :
In this paper, the case of symmetrical grid fault when using the multi-MW wind turbine of partial-scale and full-scale two-level power converter are designed and investigated. Firstly, the different operation behaviors of the relevant power converters under the voltage dip will be described and analyzed. Simulations of different configurations regarding the loss distribution and the junction temperature of the power device are presented in respect to the various voltage dips. It is concluded that for both systems the power loss will change dramatically during the Low-Voltage Ride Through (LVRT) condition as well as the junction temperature. For the full-scale wind turbine system, the most thermal stressed power device in the grid-side converter will appear at the grid voltage below 0.5 pu, and for the partial-scale wind turbine system, the most thermal stressed power device in the rotor-side converter will appear around 0.6 pu grid voltage.
Keywords :
losses; power convertors; power generation faults; power grids; thermal stresses; wind power plants; wind turbines; LVRT condition; full-scale two-level power converter; full-scale wind turbine system; grid-side converter; junction temperature; low-voltage ride through condition; multiMW wind turbine; partial-scale two-level power converter; partial-scale wind turbine system; power loss distribution; rotor-side converter; symmetrical grid fault; thermal stressed power device analysis; two-level wind power converter; voltage dip; Insulated gate bipolar transistors; Junctions; Reactive power; Rotors; Stators; Voltage fluctuations; Wind speed;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
Conference_Location :
Vienna
ISSN :
1553-572X
Type :
conf
DOI :
10.1109/IECON.2013.6699422
Filename :
6699422
Link To Document :
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