• DocumentCode
    666354
  • Title

    Frequency model of haptic information in rubbing motion

  • Author

    Miyagi, Tsukasa ; Katsura, Seiichiro

  • Author_Institution
    Sch. of Integrated Design Eng., Keio Univ., Yokohama, Japan
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    4132
  • Lastpage
    4137
  • Abstract
    This paper proposes the new frequency model of haptic information focused on the vibration component in friction force. Recently, haptic information is attracting attention from many areas as the tertiary media following the audio and visual information. However, due to the characters of the bidirectionality and self-reference, treatment is difficult as compared to the other sensory information. Unified representation method still not been established. Therefore, this paper focuses on the vibration components of friction force in rubbing motion against environmental surface in particular. The friction force in rubbing motion is measured for broadband by using the 2-DOF system constructed by two linear motors. For the quantitative evaluation of the frequency domain, cepstral analysis which is the method for voice-print analysis is applied. The effectiveness of the proposed model is shown by performing experiments and analysis with three different environmental surfaces. Moreover, this paper presents the identification for each parameters of the model from the acquired data, and construct a accurate model of the friction force for each environment.
  • Keywords
    friction; haptic interfaces; vibrations; 2-DOF system; audio information; cepstral analysis; frequency model; friction force; haptic information; linear motors; rubbing motion; tertiary media; unified representation method; vibration components; visual information; voice-print analysis; Aluminum; Cepstral analysis; Force; Frequency-domain analysis; Friction; Haptic interfaces; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6699798
  • Filename
    6699798