• DocumentCode
    666694
  • Title

    An enhanced MMC topology with DC fault ride-through capability

  • Author

    Xiaoqian Li ; Wenhua Liu ; Qiang Song ; Hong Rao ; Shukai Xu

  • Author_Institution
    Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
  • fYear
    2013
  • fDate
    10-13 Nov. 2013
  • Firstpage
    6182
  • Lastpage
    6188
  • Abstract
    High-voltage direct current system using modular multilevel converter (MMC-HVDC) is a potential candidate for grid integration of renewable energy over long distances. The dc-link fault is an issue MMC-HVDC must deal with. This paper proposed an enhanced MMC topology with dc fault ride-through capability. By using diode clamp sub-modules, the freewheeling effect of diodes is eliminated and fault currents can be very rapidly extinguished. Since the tripping of circuit breakers is avoided, MMC can immediately restart power transmission for non-permanent faults. The required rated voltage of additional semiconductors is half the conventional semiconductors, resulting in low extra cost. Simulation results using PSCAD/EMTDC have verified the validity of the proposed protection scheme.
  • Keywords
    HVDC power transmission; circuit breakers; diodes; electrical faults; power convertors; power grids; MMC topology; MMC-HVDC; circuit breaker tripping; dc fault ride-through capability; diode; diode clamp submodule; fault currents; freewheeling effect; grid integration; high-voltage direct current system; modular multilevel converter; nonpermanent fault; power transmission; renewable energy; semiconductor device; Circuit breakers; Circuit faults; Clamps; Fault currents; Insulated gate bipolar transistors; Semiconductor diodes; Topology; Dc fault; fault clearance; modular multilevel converter (MMC); system recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2013 - 39th Annual Conference of the IEEE
  • Conference_Location
    Vienna
  • ISSN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2013.6700152
  • Filename
    6700152