Fabrication of GaInP/GaAs//Si Solar Cells by Surface Activated Direct Wafer Bonding

GaInP/GaAs//Si solar cells with three active p-n junctions were fabricated by surface activated direct wafer bonding between GaAs and Si. The direct wafer bond is performed at room temperature and leads to a conductive and transparent interface. This allows the fabrication of high-efficiency monolithic tandem solar cells with active junctions in both Si and the III-V materials. This technology overcomes earlier challenges of III-V and Si integration caused by the large difference in lattice constant and thermal expansion. Transmission electron microscopy revealed a 5-nm thin amorphous interface layer formed by the argon fast atom beam treatment before bonding. No further defects or voids are detected in the photoactive layers. First triple-junction solar cell devices on Si reached an efficiency of 23.6% under concentrated illumination.