Title :
Self-formation processes in high-speed integrated circuits
Author_Institution :
Dept. of Comput. Eng., Vilnius Gediminas Tech. Univ., Vilnius, Lithuania
Abstract :
This paper presents the analysis of self-formation processes of micro and nanostructures in technologies of manufacturing high-speed semiconductor devices and integrated circuits (ICs) according possibilities to receive the minimal width of the base area and the methods used for the formation of contacts and electrodes. The results of the implementation of self-formation processes for creating new technologies of manufacturing semiconductor devices and ICs have been presented.
Keywords :
electrical contacts; forming processes; high-speed integrated circuits; integrated circuit manufacture; semiconductor device manufacture; IC; contacts; electrodes; high-speed integrated circuit; high-speed semiconductor device manufacturing; integrated circui manufacturing; microstructure; nanostructure; self-formation process; Electrodes; Etching; Geometry; Lithography; Microstructure; Oxidation; Transistors; Self-formation processes; integrated circuits (ICs); non-lithography methods;
Conference_Titel :
NORCHIP, 2013
Conference_Location :
Vilnius
DOI :
10.1109/NORCHIP.2013.6701997
