• DocumentCode
    667955
  • Title

    Analysis of glass interposer PDN and proposal of PDN resonance suppression methods

  • Author

    Jonghyun Cho ; Youngwoo Kim ; Joungho Kim ; Sundaram, Venky ; Tummala, Rao

  • Author_Institution
    Dept. of Electr. Eng., KAIST, Daejeon, South Korea
  • fYear
    2013
  • fDate
    2-4 Oct. 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Electrical characteristics of glass interposer PDN is analyzed and compared with silicon interposer. Because of the low loss of glass substrate compared to silicon substrate, glass interposer has much smaller loss than silicon interposer. It helps low-loss signaling, but it generates sharp PDN resonance unlike silicon interposer. If glass interposer signal line has through-glass via (TGV), it experiences high loss at the resonance frequency. Also P/G noise is easily coupled to signal line and vice versa at that frequency. It would be problems for the glass interposer PDN design. To overcome these problems of glass interposer, several resonance suppression methods are proposed such as decoupling capacitor scheme, ground via.
  • Keywords
    elemental semiconductors; glass; integrated circuit interconnections; silicon; three-dimensional integrated circuits; PDN resonance suppression methods; TGV; decoupling capacitor scheme; glass interposer PDN design; ground via; power distribution network; silicon interposer; through glass via; Capacitors; Couplings; Glass; Insertion loss; Noise; Resonant frequency; Silicon; PDN; glass; interposer; resonance; resonance suppr ession; silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/3DIC.2013.6702320
  • Filename
    6702320