DocumentCode :
667980
Title :
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications
Author :
Lamy, Yann ; Dussopt, Laurent ; El Bouayadi, Ossama ; Ferrandon, C. ; Siligaris, Alexandre ; Dehos, Cedric ; Vincent, Pierre
Author_Institution :
LETI, CEA, Grenoble, France
fYear :
2013
fDate :
2-4 Oct. 2013
Firstpage :
1
Lastpage :
6
Abstract :
A 6.5×6.5 mm2 compact silicon interposer encompassing 2 Tx/Rx antenna, one RF chips, TSV via-last has been designed and fabricated for 60 GHz fast data transmission applications. First characterizations are described in this paper with a focus on reliability, antenna performances and Through-Silicon-Vias (TSV) characterization. It is first shown that more than 500 thermal cycles can be achieved with a double polymer layer passivation on the Si interposer backside and polymer core solder balls. Secondly, the folded dipole antenna with a reflector on PCB have shown suitable properties (5 dBi in gain, -10 dB cross polarization) for mmw applications, which make silicon a competitive substrate for antenna integration. Finally, single TSV Ground-Signal-Ground transition has been characterized and successfully extracted up to 67GHz, with loss below 0.6 dB at 60GHz.
Keywords :
dipole antennas; millimetre wave antennas; polymers; printed circuits; receiving antennas; soldering; three-dimensional integrated circuits; transmitting antennas; wireless channels; PCB; Si; Si interposer backside; TSV; Tx-Rx antenna; antenna integration; antenna performances; compact 3D silicon interposer package; compact silicon interposer; data transmission; double polymer layer passivation; folded dipole antenna; frequency 60 GHz; ground-signal-ground transition; integrated antenna; polymer core; reliability; solder balls; through-silicon-vias; wireless applications; Antennas; Polymers; Radio frequency; Reliability; Silicon; Through-silicon vias; Vehicles; 3D; TSV last; integrated antenna; silicon interposer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/3DIC.2013.6702345
Filename :
6702345
Link To Document :
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