DocumentCode
667986
Title
Design of 60 GHz contactless probe system for RDL in passive silicon interposer
Author
Suh, Edward J. ; Franzon, Paul D.
Author_Institution
Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
2013
fDate
2-4 Oct. 2013
Firstpage
1
Lastpage
5
Abstract
A probe design for detecting discontinuities of a redistribution layer (RDL) on TSV silicon interposer is presented in this paper. The probe is a 60 GHz contactless system based on a quarter-wavelength directional coupler, using the capacitive coupling effects between two signal traces. The probes consists of one ground plane and one signal trace embedded in BCB, low dielectric constant insulator. The length, width, and thickness of the contactless probe are 749.3 um, 100.584 um, and 10.414 um, respectively. A time-domain reflectometery (TDR) pulse with 10 ps rise time makes it possible to obtain high resolution. A variation of the probe´s TDR signal through two capacitance coupling effects indicates the location of the open or short circuit fault where RDL has. Reaching a peak and dip of the probe´s TDR signal represents the open and short circuit sites, respectively.
Keywords
millimetre wave directional couplers; permittivity; three-dimensional integrated circuits; time-domain reflectometry; RDL; Si; TDR signal; TSV silicon interposer; capacitance coupling effects; capacitive coupling effects; contactless probe system; dielectric constant; directional coupler; frequency 60 GHz; open circuit fault; passive silicon interposer; redistribution layer; short circuit fault; time-domain reflectometery; Capacitance; Couplings; Dielectric constant; Impedance; Power transmission lines; Probes; Silicon; Contactless probe; capacitive coupling; interposer; quarter-wavelength coupler; time-domain reflectometery;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/3DIC.2013.6702352
Filename
6702352
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