DocumentCode :
668006
Title :
Vertically integrated processor and memory module design for vector supercomputers
Author :
Egawa, R. ; Sato, Mitsuhisa ; Tada, Jubee ; Kobayashi, Hideo
Author_Institution :
Cyberscinece Center, Tohoku Univ., Sendai, Japan
fYear :
2013
fDate :
2-4 Oct. 2013
Firstpage :
1
Lastpage :
6
Abstract :
To overcome the memory and power wall problems on a high performance microprocessor for supercomputer systems, the reduction in memory access latencies and its power consumptions is urgently required. Recently, a 2.5D integration technology, which can integrate multiple chips on a silicon die by using vertical interconnects, are expected as key technologies to overcome these problems. Under this situation, this paper explores the design space of a processor and memory module for vector supercomputers using a vertical integration technology. In this study, both a processor and a memory of vector supercomputers are integrated in one silicon die as a single module, and its performance and power are evaluated by leading scientific applications. The evaluation results demonstrated that the 2.5D integration reduces the energy consumption by 83% compared to the conventional PCB implementation.
Keywords :
elemental semiconductors; integrated circuit design; integrated circuit interconnections; integrated memory circuits; mainframes; microprocessor chips; silicon; three-dimensional integrated circuits; 2.5D integration technology; design space; memory access latency; memory module design; vector supercomputer systems; vertical interconnects; vertically integrated processor; Bandwidth; Energy consumption; Memory management; Power demand; Silicon; Supercomputers; Vectors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/3DIC.2013.6702377
Filename :
6702377
Link To Document :
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