DocumentCode
668017
Title
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods
Author
Cho, Jonghyun ; Kim, Youngwoo ; Kim, Joungho ; Sundaram, Venky ; Tummala, Rao
Author_Institution
Department of Electrical Engineering, KAIST, Daejeon, South Korea
fYear
2013
fDate
2-4 Oct. 2013
Firstpage
1
Lastpage
5
Abstract
Electrical characteristics of glass interposer PDN is analyzed and compared with silicon interposer. Because of the low loss of glass substrate compared to silicon substrate, glass interposer has much smaller loss than silicon interposer. It helps low-loss signaling, but it generates sharp PDN resonance unlike silicon interposer. If glass interposer signal line has through-glass via (TGV), it experiences high loss at the resonance frequency. Also P/G noise is easily coupled to signal line and vice versa at that frequency. It would be problems for the glass interposer PDN design. To overcome these problems of glass interposer, several resonance suppression methods are proposed such as decoupling capacitor scheme, ground via.
Keywords
PDN; glass; interposer; resonance; resonance suppr ession; silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location
San Francisco, CA, USA
Type
conf
DOI
10.1109/3DIC.2013.6702391
Filename
6702391
Link To Document