Title :
TSV-based, modular and collision detectable face-to-back shared bus design
Author :
Zhenqian Zhang ; Franzon, P.
Author_Institution :
Dept. of ECE, North Carolina State Univ., Raleigh, NC, USA
Abstract :
In this paper, we present a shared backbone bus solution specially tuned for modular 3DIC post-silicon-stacking. The proposed solution allows multiple parallel TSV-based channels to be placed and shared among various stacked components, which is uniquely supported by the dense connection pitch of the Face-to-back TSV bonding technology. To support the plug-n-play features, a distributed arbitration and collision detection structure is designed and evaluated. A demo of 16-channel shared bus is synthesized and verified under .13 μm technology. The conservative power estimate is 0.20 pJ/bit and bandwidth per area is 0.984 Tbps/mm2.
Keywords :
integrated circuit bonding; integrated circuit design; three-dimensional integrated circuits; TSV-based modular bus design; collision detectable face-to-back shared bus design; collision detection structure; dense connection pitch; distributed arbitration; face-to-back TSV bonding technology; modular 3DIC post-silicon-stacking; parallel TSV-based channels; plug-n-play features; shared backbone bus solution; size 0.13 mum; stacked components; Bandwidth; Channel estimation; Computer architecture; Conferences; System-on-chip; Three-dimensional displays; Through-silicon vias; 3DIC; Through-silicon-via; post-silicon-stacking; shared bus;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2013 IEEE International
Conference_Location :
San Francisco, CA
DOI :
10.1109/3DIC.2013.6702399
