TSV-based, modular and collision detectable face-to-back shared bus design

In this paper, we present a shared backbone bus solution specially tuned for modular 3DIC post-silicon-stacking. The proposed solution allows multiple parallel TSV-based channels to be placed and shared among various stacked components, which is uniquely supported by the dense connection pitch of the Face-to-back TSV bonding technology. To support the plug-n-play features, a distributed arbitration and collision detection structure is designed and evaluated. A demo of 16-channel shared bus is synthesized and verified under .13 μm technology. The conservative power estimate is 0.20 pJ/bit and bandwidth per area is 0.984 Tbps/mm².