DocumentCode :
668688
Title :
The comparative analysis of difference between R&D innovation TFP and integrative TFP in China´s high-tech industry
Author :
Ai Mingye ; Piao Meilan
Author_Institution :
Sch. of Econ. & Manage., Harbin Eng. Univ., Harbin, China
Volume :
2
fYear :
2013
fDate :
23-24 Nov. 2013
Firstpage :
9
Lastpage :
14
Abstract :
Based on the panel data of 17 subdivision industries of high-tech industry in China between 1999 and 2011, the paper calculates integrative TFP and R&D innovation TFP respectively and analyzed the causes of the differences between them by the method of Malmquist index of DEA model. The results show that the integrative TFP of each subdivision industry of high-tech industry mostly presents a trend of growth, and the growth mainly results from the joint improvement of both technical efficiency and technical progress. Moreover, the technical efficiency played a negative role on the growth of integrative TFP, the improvement and reduction of TFP has a certain difference between subdivision industries. The R&D innovation TFP of each subdivision industry of high-tech industry in China has been in low efficiency all the time, it is mainly due to appearing a negative growth in technical progress. The reasons to difference are analyzed.
Keywords :
data envelopment analysis; innovation management; productivity; China high-tech industry; DEA model; Malmquist index; R and D innovation TFP; data envelopment analysis; integrative TFP; research and development; technical efficiency; technical progress; total factor productivity; Economics; Indexes; Industries; Investment; Productivity; Technological innovation; High-tech industry; Malmquist index; R&D efficiency; total factor productivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Management, Innovation Management and Industrial Engineering (ICIII), 2013 6th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4799-3985-5
Type :
conf
DOI :
10.1109/ICIII.2013.6703244
Filename :
6703244
Link To Document :
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