DocumentCode :
66875
Title :
High-Performance GAA Sidewall-Damascened Sub-10-nm In Situ n+-Doped Poly-Si NWs Channels Junctionless FETs
Author :
Po-Yi Kuo ; Yi-Hsien Lu ; Tien-Sheng Chao
Author_Institution :
Dept. of Electrophys., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
61
Issue :
11
fYear :
2014
fDate :
Nov. 2014
Firstpage :
3821
Lastpage :
3826
Abstract :
The gate-all-around sidewall-damascened sub10-nm in situ n+-doped poly-Si nanowires channels junctionless FETs (GAA SWDNW-JLFETs) with one NW of sub-50-nm2 cross-sectional area have been successfully fabricated and demonstrated in the category of poly-Si NWs JL transistors for the first time. Some key properties are explored: 1) novel SWDNW processes; 2) dependence of threshold voltage (VTii) and subthreshold swing (S.S.) on dimension of in situ n+-doped poly-Si NWs in GAA SWDNW-JLFETs; and 3) thermal stability of main electrical characteristics under high operating temperature. The high-performance GAA SWDNW-JLFETs show good electrical characteristics: 1) steep S.S. ~ 75 mV/decade; 2) low gate supply voltage (VG ) = 1.5 V; 3) high ON/OFF currents ratio (ION/IOFF) ~ 8 × 107 and significantly high-thermal stability without implantation processes and hydrogen-related plasma treatments for future 3-D integrated circuits, system-on-panel, and system-on-chip applications.
Keywords :
elemental semiconductors; field effect transistors; nanoelectronics; nanowires; silicon; thermal stability; 3D integrated circuits; GAA SWDNW-JLFETs; JL transistors; Si; gate-all-around silicon nanowire transistor; high-performance GAA sidewall-damascened in situ n+-doped polysilicon NWs channel junctionless FETs; high-thermal stability; subthreshold swing; system-on-chip; system-on-panel; threshold voltage dependence; Electric variables; Logic gates; Nanowires; Sandwich structures; Thermal stability; Transistors; Gate-all-around (GAA); junctionless (JL); sidewall-damascened nanowires (SWDNWs);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2354436
Filename :
6897955
Link To Document :
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