DocumentCode
668900
Title
Design and fabrication of geometrically complicated multiband microwave devices using a novel integrated 3D printing technique
Author
Ahmadloo, Majid
Author_Institution
Telecommun. Res. Labs.; TRTech (former TRLabs), Edmonton, AB, Canada
fYear
2013
fDate
27-30 Oct. 2013
Firstpage
29
Lastpage
32
Abstract
In this work a novel fast and efficient three dimensional (3D) printing technique is presented for prototyping and fabrication of 3D microwave structures to print both the conductive nanoparticle ink together with the dielectric material in an integrated process. This facilitates the fabrication of complicated 3D electromagnetic (EM) structures such as wide range of different multiband antennas and microwave devices. The process includes characterization of conductive ink and polymer based substrate to ensure proper RF, electrical, thermal and mechanical performances of both substrate and the ink. As most of the printed devices are relatively simple single band systems, in this work in order to demonstrate the performance of the proposed 3D printing technique, a geometrically complicated multiband meander line 3D dipole antenna is printed, tested and measured results are compared with simulations to verify the accuracy of the fabrication technique. Good agreement between measured and simulated results shows the efficiency and accuracy of the proposed fabrication technique. This not only provides a low cost, environmentally friendly integrated fabrication process but also enables us to use the technique on geometrically complicated multiband EM devices.
Keywords
dipole antennas; microwave antennas; microwave devices; microwave materials; multifrequency antennas; three-dimensional printing; 3D dipole antenna; 3D microwave structure; conductive ink; conductive nanoparticle ink; dielectric material; geometrically complicated multiband meander line; geometrically complicated multiband microwave device; integrated 3D printing technique; integrated process; multiband antenna; polymer based substrate; three dimensional printing technique; Antenna measurements; Dipole antennas; Fabrication; Ink; Printing; Three-dimensional displays; fabrication of 3D microwave structures; integrated 3D printing; multiband printed meander line dipole antenna; nano-particle conductive ink;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-0705-2
Type
conf
DOI
10.1109/EPEPS.2013.6703460
Filename
6703460
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