Cost effective modeling methodologies and evaluating electrical interaction in FCBGA packages

Author

Hyunho Baek ; Delino, Julius ; Eisenstadt, William R.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA

fYear

2013

fDate

27-30 Oct. 2013

Firstpage

103

Lastpage

106

Abstract

This paper demonstrates a modeling methodology for the die-to-package connectivity in a Flip-chip Ball Grid Array (FCBGA) so that the die and package are simulated separately instead of co-simulation of the FCBGA structure for saving a computational cost. In addition, a cost saving polynomial regression modeling method is proposed to find electrical behavior for huge and complex package structures. In addition, various types of patterns were simulated to investigate and evaluate electrical interactions between the die and package through C4 bumps.

Keywords

ball grid arrays; flip-chip devices; regression analysis; FCBGA packages; FCBGA structure; complex package structures; cost effective modeling; die-to-package connectivity; electrical interactions; flip-chip ball grid array; polynomial regression; Computational modeling; Metals; Polynomials; Ports (Computers); Scattering parameters; Solid modeling; Three-dimensional displays; Electrical behavior; FCBGA; Modeling methodology; Polynomial regression; S-parameter;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on

Conference_Location

San Jose, CA

Print_ISBN

978-1-4799-0705-2

Type

conf

DOI

10.1109/EPEPS.2013.6703476

Filename

6703476