Title :
Electrical-thermal co-simulation for DC IR-drop analysis of large-scale integrated circuits
Author :
Tianjian Lu ; Jian-Ming Jin
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary in order to take into account the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method due to its capabilities in modeling complex geometries and materials. In order to deal with large-scale problems, a domain decomposition scheme is applied to the finite element method to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.
Keywords :
finite element analysis; integrated circuits; large-scale systems; microprocessor chips; DC IR-drop analysis; Joule heating; complex geometry; domain decomposition; electrical-thermal co-simulation; finite element method; large-scale integrated circuits; large-scale problems; multiple processors; Conductivity; Equations; Heating; Integrated circuit interconnections; Mathematical model; Program processors; Temperature distribution;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
DOI :
10.1109/EPEPS.2013.6703477
