Electrical-thermal co-simulation for DC IR-drop analysis of large-scale integrated circuits

Author

Tianjian Lu ; Jian-Ming Jin

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA

fYear

2013

fDate

27-30 Oct. 2013

Firstpage

107

Lastpage

110

Abstract

For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary in order to take into account the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method due to its capabilities in modeling complex geometries and materials. In order to deal with large-scale problems, a domain decomposition scheme is applied to the finite element method to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.

Keywords

finite element analysis; integrated circuits; large-scale systems; microprocessor chips; DC IR-drop analysis; Joule heating; complex geometry; domain decomposition; electrical-thermal co-simulation; finite element method; large-scale integrated circuits; large-scale problems; multiple processors; Conductivity; Equations; Heating; Integrated circuit interconnections; Mathematical model; Program processors; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on

Conference_Location

San Jose, CA

Print_ISBN

978-1-4799-0705-2

Type

conf

DOI

10.1109/EPEPS.2013.6703477

Filename

6703477