• DocumentCode
    668926
  • Title

    On-die supply-inducecd jitter behavioral modeling

  • Author

    Xiaoqing Wang ; Martin, Andrew

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    2013
  • fDate
    27-30 Oct. 2013
  • Firstpage
    147
  • Lastpage
    150
  • Abstract
    This paper describes a simple, yet efficient supply-induced jitter modeling methodology for high-speed I/O circuits. The proposed model uses the average supply noise and a linear factor derived from Spice simulations to estimate the jitter for a circuit block. For circuits with bias voltages, the transfer function of the biasing network is included. The model is implemented in Simulink and closely correlated with Spice simulations. The modeling accuracy is further validated to be within ±15% of the silicon measurement for the period jitter of a ring oscillator. The jitter modeling technique is applied to multiple memory I/O designs and can be extended to other high-speed interface designs and their timing budgeting.
  • Keywords
    high-speed integrated circuits; integrated circuit modelling; jitter; oscillators; transfer functions; Simulink; Spice simulations; average supply noise; bias voltages; biasing network; circuit block; high-speed I/O circuits; high-speed interface designs; linear factor; multiple memory I/O designs; on-die supply-induced jitter behavioral modeling; ring oscillator; silicon measurement; timing budgeting; transfer function; Computational modeling; Delays; Integrated circuit modeling; Jitter; Mathematical model; Noise; Ring oscillators; high-speed integrated circuits; power supply noise; timing jitter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-0705-2
  • Type

    conf

  • DOI
    10.1109/EPEPS.2013.6703486
  • Filename
    6703486