DocumentCode :
668926
Title :
On-die supply-inducecd jitter behavioral modeling
Author :
Xiaoqing Wang ; Martin, Andrew
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2013
fDate :
27-30 Oct. 2013
Firstpage :
147
Lastpage :
150
Abstract :
This paper describes a simple, yet efficient supply-induced jitter modeling methodology for high-speed I/O circuits. The proposed model uses the average supply noise and a linear factor derived from Spice simulations to estimate the jitter for a circuit block. For circuits with bias voltages, the transfer function of the biasing network is included. The model is implemented in Simulink and closely correlated with Spice simulations. The modeling accuracy is further validated to be within ±15% of the silicon measurement for the period jitter of a ring oscillator. The jitter modeling technique is applied to multiple memory I/O designs and can be extended to other high-speed interface designs and their timing budgeting.
Keywords :
high-speed integrated circuits; integrated circuit modelling; jitter; oscillators; transfer functions; Simulink; Spice simulations; average supply noise; bias voltages; biasing network; circuit block; high-speed I/O circuits; high-speed interface designs; linear factor; multiple memory I/O designs; on-die supply-induced jitter behavioral modeling; ring oscillator; silicon measurement; timing budgeting; transfer function; Computational modeling; Delays; Integrated circuit modeling; Jitter; Mathematical model; Noise; Ring oscillators; high-speed integrated circuits; power supply noise; timing jitter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
Type :
conf
DOI :
10.1109/EPEPS.2013.6703486
Filename :
6703486
Link To Document :
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