• DocumentCode
    668929
  • Title

    Robust PoP probing solutions for high-performance application processor developments

  • Author

    Weiliang Yuan ; Sungjoo Kim ; Woong Hwan Ryu ; Seongjae Moon ; Sangmin Lee

  • Author_Institution
    Design Technol., Syst. LSI, Samsung Electron., Yongin, South Korea
  • fYear
    2013
  • fDate
    27-30 Oct. 2013
  • Firstpage
    159
  • Lastpage
    162
  • Abstract
    Probing solution is crucial for the designs and validation of high-speed PoP devices in high-performance mobile application processor (AP) development, where PoP assembly technology is used to achieve high data throughput & low cost. The paper has developed robust PoP probing solution for AP product development based on microwave network theory, including probe loading effect minimization, probing channel propagation removal, waveform reconstruction at die pad and interposer/socket de-embedding, which are applied to the latest mobile application processor development. It is also straight forward and natural to extend the developed methods to TSV-based devices with WideIO interface.
  • Keywords
    integrated circuit packaging; product development; three-dimensional integrated circuits; PoP assembly technology; PoP probing solution; TSV based device; WideIO interface; die pad; high performance AP development; high speed PoP device; interposer; microwave network theory; mobile application processor development; probe loading effect minimization; probing channel propagation removal; socket deembedding; waveform reconstruction; Accuracy; Loading; Microwave theory and techniques; Mobile communication; Probes; Resistors; Sockets; application processor (AP); de-embedding; package-on-package (PoP); probing; waveform reconstruction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-0705-2
  • Type

    conf

  • DOI
    10.1109/EPEPS.2013.6703489
  • Filename
    6703489