Title :
High-speed DIMM-in-a-Package (DIAP) memory module
Author :
Zhuowen Sun ; Kyongmo Bang ; Chen, K. ; Crisp, Richard
Author_Institution :
Invensas Corp., San Jose, CA, USA
Abstract :
We presented a highly integrated quad-die memory module design using face-down wire bond assembly technology for DDR operations up to 2400 MT/s. We performed peak distortion analysis of the point-to-point DQ and fly-by Command/Address (C/A) memory buses with up to 9 aggressors on the DIAP memory module mounted on a Type-3 motherboard. We also discussed the tradeoffs when designing the package for better electrical performance and lower manufacturing cost.
Keywords :
electronics packaging; lead bonding; soldering; C-A memory buses; DDR operations; DIAP memory module; DIMM-in-a-package memory module; aggressors; face-down wire bond assembly technology; fly-by command-address memory buses; high-speed memory module; integrated quad-die memory module; point-to-point DQ; type-3 motherboard; Assembly; Microstrip; Random access memory; Routing; Stripline; Substrates; DDR4; DIAP; Fly-by; On-board memory; Soldered-down;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-0705-2
DOI :
10.1109/EPEPS.2013.6703490
